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1

Effect of PVP-coated silver nanoparticles using laser direct patterning process by photothermal effect

Yi-Ting Cheng, Rouh-Huey Uang, Kuo-Chan Chiou

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 1.53 MB

english, 2011

2

Metastatic carcinoma of the breast: A case with the unusual presentation of unilateral periorbital edema

Shu-Chen Kuo, Shih-Chuan Hsiao, Chien-Chun Chiou, Fen-Fen Chen, Kuo-Chan Huang

Journal:

Japanese Journal of Ophthalmology

Year:

2008

Language:

english

File:

PDF, 133 KB

english, 2008

3

Compatibilization and elastomer toughening of polyamide-6 (PA6)/poly(phenylene ether) (PPE) blends

Kuo-Chan Chiou, Shoei-Chin Wu, Hew-Der Wu, Feng-Chih Chang

Journal:

Journal of Applied Polymer Science

Year:

1999

Language:

english

File:

PDF, 325 KB

english, 1999

4

Reactive compatibilization of the poly(ethylene terephthalate)/liquid crystalline polymer blends by solid epoxy resin as a coupling agent

Hung-Chih Chin, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Journal of Applied Polymer Science

Year:

1996

Language:

english

File:

PDF, 3.79 MB

english, 1996

5

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - A fine line/space fabrication process on flexible polyimide film using laser direct writing method by photothermal effect of silver nanoparticles

Cheng, Yi-Ting, Uang, Rouh-Huey, Chiou, Kuo-Chan

Year:

2010

Language:

english

File:

PDF, 2.04 MB

english, 2010

6

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced materials with low dielectric properties and highly thermal conductivity

Ting, Wen-Pin, Tseng, Feng-Po, Chiou, Kuo-Chan

Year:

2016

Language:

english

File:

PDF, 1.06 MB

english, 2016

7

Reactive compatibilization of polyamide-6 (PA 6)/polybutylene terephthalate (PBT) blends by a multifunctional epoxy resin

Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2000

Language:

english

File:

PDF, 347 KB

english, 2000

8

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermal conductivity and morphology of non-covalent functionalized graphene/epoxy nanocomposites

Teng, Chih-Chun, Ma, Chen-Chi M., Chiou, Kuo-Chan, Lee, Tzong-Ming

Year:

2010

Language:

english

File:

PDF, 544 KB

english, 2010

9

Comparisons of Physical Properties of Intercalated and Exfoliated Clay/Epoxy Nanocomposites

Jan, Ing-Nan, Lee, Tzong-Ming, Chiou, Kuo-Chan, Lin, Jiang-Jen

Journal:

Industrial & Engineering Chemistry Research

Year:

2005

Language:

english

File:

PDF, 187 KB

english, 2005

10

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - High Thermal Efficiency Carbon Nanotube-Resin Matrix for Thermal Interface Materials

Tzong-Ming Lee,, Kuo-Chan Chiou,, Feng-Po Tseng,, Chia-Chi Hung,

Year:

2005

Language:

english

File:

PDF, 302 KB

english, 2005

11

Thermal conductivity and dynamic mechanical property of glycidyl methacrylate-grafted multiwalled carbon nanotube/epoxy composites

Chih-Chun Teng, Chen-Chi M. Ma, Shin-Yi Yang, Kuo-Chan Chiou, Tzong-Ming Lee, Chin-Lung Chiang

Journal:

Journal of Applied Polymer Science

Year:

2012

Language:

english

File:

PDF, 2.49 MB

english, 2012

12

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced materials with low dielectric constant and low coefficient of thermal expansion

Kuei-Yi Chuang,, Kuo-Chan Chiou,, Feng-Po Tseng,

Year:

2015

Language:

english

File:

PDF, 1.11 MB

english, 2015

13

Impact specific essential work of fracture of compatibilized polyamide-6 (PA6)/poly(phenylene ether) (PPE) blends

Kuo-Chan Chiou, Feng-Chih Chang, Yiu-Wing Mai

Journal:

Polymer Engineering & Science

Year:

2001

Language:

english

File:

PDF, 2.75 MB

english, 2001

14

Fracture toughness characterization of a PC/ABS blend under different strain rates by various J-integral methods

Ming-Luen Lu, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Polymer Engineering & Science

Year:

1996

Language:

english

File:

PDF, 655 KB

english, 1996

15

Fracture toughness characterizations of compatibilized polyamide-6 (PA6)/poly(phenylene ether) (PPE) blends

Kuo-Chan Chiou, Feng-Chih Chang, Yiu-Wing Mai

Journal:

Journal of Polymer Research

Year:

2001

File:

PDF, 649 KB

2001

16

Effect of functionalized carbon nanotubes on the thermal conductivity of epoxy composites

Shin-Yi Yang, Chen-Chi M. Ma, Chih-Chun Teng, Yen-Wei Huang, Shu-Hang Liao, Yuan-Li Huang, Hsi-Wen Tien, Tzong-Ming Lee, Kuo-Chan Chiou

Journal:

Year:

2010

Language:

english

File:

PDF, 1.61 MB

english, 2010

17

Laser annealing of gold nanoparticles thin film using photothermal effect

Yi-Ting Cheng, Rouh-Huey Uang, Yu-Ming Wang, Kuo-Chan Chiou, Tzong-Ming Lee

Journal:

Microelectronic Engineering

Year:

2009

Language:

english

File:

PDF, 459 KB

english, 2009

18

Thermal conductivity and structure of non-covalent functionalized graphene/epoxy composites

Chih-Chun Teng, Chen-Chi M. Ma, Chu-Hua Lu, Shin-Yi Yang, Shie-Heng Lee, Min-Chien Hsiao, Ming-Yu Yen, Kuo-Chan Chiou, Tzong-Ming Lee

Journal:

Year:

2011

Language:

english

File:

PDF, 1.63 MB

english, 2011

19

Synergetic effect of thermal conductive properties of epoxy composites containing functionalized multi-walled carbon nanotubes and aluminum nitride

Chih-Chun Teng, Chen-Chi M. Ma, Kuo-Chan Chiou, Tzong-Ming Lee

Journal:

Composites Part B: Engineering

Year:

2012

Language:

english

File:

PDF, 1.47 MB

english, 2012

20

Effect of temperature on fracture toughness of PC/ABS based on J-integral and hysteresis energy methods

Ming-Luen Lu, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Journal of Applied Polymer Science

Year:

1996

Language:

english

File:

PDF, 828 KB

english, 1996

21

Fracture behavior of polypropylene/ ethylene- diene-terpolymer blends : Effect of temperatures, notch radius and rubber content

Ming-Luen Lu, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Journal of Polymer Research

Year:

1996

Language:

english

File:

PDF, 792 KB

english, 1996

22

Synergetic effect of hybrid boron nitride and multi-walled carbon nanotubes on the thermal conductivity of epoxy composites

Chih-Chun Teng, Chen-Chi M. Ma, Kuo-Chan Chiou, Tzong-Ming Lee, Yeng-Fong Shih

Journal:

Materials Chemistry and Physics

Year:

2011

Language:

english

File:

PDF, 1.74 MB

english, 2011

23

Elastic-plastic fracture toughness of PC/ABS blend based on CTOD and J-integral methods

Ming-Luen Lu, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Year:

1996

Language:

english

File:

PDF, 1.11 MB

english, 1996

24

In situ compatibilized polypropylene/liquid crystalline polymer blends

Yei-Po Chiou, Kuo-Chan Chiou, Feng-Chih Chang

Journal:

Year:

1996

Language:

english

File:

PDF, 1.03 MB

english, 1996

25

Precrack hysteresis energy in determining polycarbonate ductile–brittle transition. IV. Effect of strain rate

Kuo-Chan Chiou, Hon-Chun Hsu, Feng-Chih Chang

Journal:

Journal of Applied Polymer Science

Year:

1997

Language:

english

File:

PDF, 322 KB

english, 1997

26

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - High frequency substrate materials with highly thermal resistance and low dielectric properties

Tseng, Feng-Po, Chuang, Kuei-Yi, Liao, Lu-Shih, Chiou, Kuo-Chan

Year:

2013

Language:

english

File:

PDF, 872 KB

english, 2013

27

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Preparation and characterization of nano-inorganic materials coated multi-walled carbon nanotubes/epoxy composites for thermal interface materials

Chih-Chun Teng,, Chen-Chi M. Ma,, Shin-Yi Yang,, Yen-Wei H,, Kuo-Chan Chiou,, Tzong-Ming Lee,, Wei-Syuan He,, Jen-Chi Chuiang,

Year:

2009

Language:

english

File:

PDF, 1.31 MB

english, 2009

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